Honor’s Magic V2 has been the thinnest large-format foldable smartphone ever since it came out in July of last year. That 9.9mm thickness while folded has thus been quite the tough nut to crack for the competition, but Honor hasn’t rested on its laurels.
The brand has today revealed on Weibo that the upcoming Magic V3 will “raise the bar once again” when it comes to how slim such a foldable can be.
While Honor itself hasn’t said anything more, a tipster over on X claims the device won’t go below 9mm, but will still be thinner than its predecessor. So with that in mind, the range we’re looking at is 9mm to 9.98mm.
The same tipster also claims it will be powered by the Snapdragon 8 Gen 3 chipset, will have support for “5.5G” and satellite connectivity in China, and will weigh between 220g and 229g. The battery will be between 5,000 mAh and 5,990 mAh, and it will have support for 66W wired charging. There’s also going to be a 50 MP “eagle eye camera” on offer, as well as an “ultra thin” USB Type-C port.
Previous rumors claimed the Honor Magic V3 would land in July, and the fact that the brand has started its teaser campaign today seems to confirm that.